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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 74AUP1G386GM

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導體已決定直接通過互聯網發(fā)布其產品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關資料,以協助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據,這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93528000613274AUP1G386GM,13274AUP1G386GMSOT886 (XSON6)RFS1
93528000611574AUP1G386GM,11574AUP1G386GMSOT886 (XSON6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 18170 ppm; substance 1333-86-4: 1038 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 18170 ppm; substance 1333-86-4: 1038 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 444 ppm; substance 7440-57-5: 8696 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilica7631-86-90.00250050.0000000.128193
AdhesivePolymerEpoxy resin system0.00150030.0000000.076916
AdhesivePolymerFormaldehyde-phenol copolymer9003-35-40.00050010.0000000.025639
AdhesiveFillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.012820
AdhesiveAdditiveNon-declarable0.0002505.0000000.012819
Adhesive Total0.005000100.0000000.256387
DieDoped SiliconSilicon (Si)7440-21-30.090206100.0000004.625519
Die Total0.090206100.0000004.625519
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000037.412784
Lead FrameCopper alloyNickel (Ni)7440-02-00.0227742.9500001.167789
Lead FrameCopper alloySilicon (Si)7440-21-30.0049410.6400000.253361
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0011580.1500000.059379
Base Alloy Total0.75849098.25000038.893313
Lead FramePure metal layerNickel (Ni)7440-02-00.0126611.6400000.649222
Pre-Plating 1 Total0.0126611.6400000.649222
Lead FramePure metal layerPalladium (Pd)7440-05-30.0006950.0900000.035638
Pre-Plating 2 Total0.0006950.0900000.035638
Lead FramePure metal layerGold (Au)7440-57-50.0001540.0200000.007896
Pre-Plating 3 Total0.0001540.0200000.007896
Lead Frame Total0.772000100.00000039.586069
Mould CompoundFillerSilica fused60676-86-00.91835986.15000047.090962
Mould CompoundPolymerEpoxy resin system0.0924228.6700004.739150
Mould CompoundHardenerPhenolic resin0.0457314.2900002.344962
Mould CompoundAdditiveNon-declarable0.0043720.4100000.224184
Mould CompoundFillerSilica7631-86-90.0030910.2900000.158498
Mould CompoundPigmentCarbon black1333-86-40.0020250.1900000.103837
Mould Compound Total1.066000100.00000054.661593
WireGold alloyGold (Au)7440-57-50.01680599.0000000.861715
WireGold alloyPalladium (Pd)7440-05-30.0001701.0000000.008717
Wire Total0.016975100.0000000.870432
74AUP1G386GM Total1.950181100.000000
Notes
Report created on 2025-04-07 16:31:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-04-07 16:31:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導體芯片 (Die)??????
基底合金 (Base Alloy)??????
預鍍層1 (Pre-Plating 1)??????
預鍍層2 (Pre-Plating 2)??????
預鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
導線 (Wire)??????
? 表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-04-07 16:31:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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