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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 74AUP2G3404GM

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標準。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93529779612574AUP2G3404GM,12574AUP2G3404GMSOT886 (XSON6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 18590 ppm; substance 1333-86-4: 1061 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 18590 ppm; substance 1333-86-4: 1061 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 119 ppm; substance 7440-05-3: 591 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilica7631-86-90.00250050.0000000.131163
AdhesivePolymerEpoxy resin system0.00150030.0000000.078698
AdhesivePolymerFormaldehyde-phenol copolymer9003-35-40.00050010.0000000.026232
AdhesiveFillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013116
AdhesiveAdditiveNon-declarable0.0002505.0000000.013116
Adhesive Total0.005000100.0000000.262325
DieDoped siliconSilicon (Si)7440-21-30.049629100.0000002.603788
Die Total0.049629100.0000002.603788
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.279388
Lead FrameCopper alloyNickel (Ni)7440-02-00.0227742.9500001.194839
Lead FrameCopper alloySilicon (Si)7440-21-30.0049410.6400000.259230
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0011580.1500000.060754
Base Alloy Total0.75849098.25000039.794211
Lead FramePure metal layerNickel (Ni)7440-02-00.0126611.6400000.664260
Pre-Plating 1 Total0.0126611.6400000.664260
Lead FramePure metal layerGold (Au)7440-57-50.0001540.0200000.008080
Pre-Plating 2 Total0.0001540.0200000.008080
Lead FramePure metal layerPalladium (Pd)7440-05-30.0006950.0900000.036463
Pre-Plating 3 Total0.0006950.0900000.036463
Lead Frame Total0.772000100.00000040.503014
Mould CompoundFillerSilica fused60676-86-00.91749786.15000048.136520
Mould CompoundPolymerEpoxy resin system0.0923358.6700004.844360
Mould CompoundHardenerPhenolic resin0.0456884.2900002.397023
Mould CompoundAdditiveNon-declarable0.0043670.4100000.229115
Mould CompoundFillerSilica7631-86-90.0030890.2900000.162065
Mould CompoundPigmentCarbon black1333-86-40.0020240.1900000.106189
Mould Compound Total1.065000100.00000055.875272
WirePure metalCopper (Cu)7440-50-80.01389696.4900000.729054
WireImpurityNon-declarable0.0000020.0100000.000105
WirePure metal layerPalladium (Pd)7440-05-30.0004323.0000000.022665
Wire Coating 1 Total0.0004323.0000000.022665
WirePure metal layerGold (Au)7440-57-50.0000720.5000000.003777
Wire Coating 2 Total0.0000720.5000000.003777
Wire Total0.014402100.0000000.755601
74AUP2G3404GM Total1.906031100.000000
Notes
Report created on 2025-01-19 09:38:38 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-01-19 09:38:38 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
導(dǎo)線 (Wire)??????
導(dǎo)線涂層1 (Wire Coating 1)??????
導(dǎo)線涂層2 (Wire Coating 2)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-01-19 09:38:38 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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