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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 74HCT4066PW

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶(hù)提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估??蛻?hù)可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93518751011874HCT4066PW,11874HCT4066PWSOT402-1 (TSSOP14)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 5411 ppm; substance 1333-86-4: 1218 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 5411 ppm; substance 1333-86-4: 1218 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 599 ppm; substance 7440-57-5: 56 ppm; substance 7440-05-3: 112 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.03116077.9000000.059940
AdhesivePolymerAcrylic resin0.00608015.2000000.011696
AdhesivePolymerResin system0.0027606.9000000.005308
Adhesive Total0.040000100.0000000.076944
DieDoped siliconSilicon (Si)7440-21-30.352529100.0000000.678127
Die Total0.352529100.0000000.678127
Lead FrameCopper alloyCopper (Cu)7440-50-819.04563896.04456936.636315
Lead FrameCopper alloyIron (Fe)7439-89-60.4689602.3649020.902095
Lead FrameCopper alloyZinc (Zn)7440-66-60.0195400.0985370.037587
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0058620.0295610.011276
Base Alloy Total19.54000098.53756937.587273
Lead FramePure metal layerGold (Au)7440-57-50.0029000.0146240.005578
Pre-Plating 1 Total0.0029000.0146240.005578
Lead FramePure metal layerPalladium (Pd)7440-05-30.0058000.0292490.011157
Pre-Plating 2 Total0.0058000.0292490.011157
Lead FramePure metal layerNickel (Ni)7440-02-00.2813001.4185580.541111
Pre-Plating 3 Total0.2813001.4185580.541111
Lead Frame Total19.830000100.00000038.145119
Mould CompoundFillerSilica fused60676-86-024.81494478.33000047.734191
Mould CompoundPolymerEpoxy resin system2.8074828.8620005.400490
Mould CompoundFlame retardantMagnesium hydroxide (Mg(OH)2)1309-42-81.9324806.1000003.717331
Mould CompoundPolymerPhenolic resin1.8716545.9080003.600327
Mould CompoundFillerSilica7631-86-90.1900800.6000000.365639
Mould CompoundPigmentCarbon black1333-86-40.0633600.2000000.121880
Mould Compound Total31.680000100.00000060.939858
WirePure metalCopper (Cu)7440-50-80.083152100.0000000.159952
Wire Total0.083152100.0000000.159952
74HCT4066PW Total51.985681100.000000100.000000
Notes
Report created on 2024-12-21 22:13:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:13:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱(chēng)
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
導(dǎo)線(xiàn) (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:13:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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