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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 BC69-16PAS

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934068112115BC69-16PASXBC69-16PASSOT1061D (HUSON3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 17377 ppm; substance 1333-86-4: 1067 ppm; substance 7439-92-1: 1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 17377 ppm; substance 1333-86-4: 1067 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 11603 ppm; substance 7440-05-3: 371 ppm; substance 7440-57-5: 222 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.160338
AdhesivePolymerPoly(isobornyl) methacrylate64114-51-80.01100010.0000000.145042
AdhesivePolymerBismaleimide resin0.0096258.7500000.126912
AdhesivePolymerPolysiloxanes63148-53-80.0011001.0000000.014504
AdhesivePolymerAcrylic resin0.0002640.2400000.003481
AdhesiveCuring accelerators/CatalystPalladium (Pd)7440-05-30.0000110.0100000.000145
Adhesive Total0.110000100.0000001.450422
DieDoped siliconSilicon (Si)7440-21-30.230000100.0000003.032700
Die Total0.230000100.0000003.032700
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.695068
Lead FrameCopper alloyNickel (Ni)7440-02-00.1037483.7000001.367985
Lead FrameCopper alloySilicon (Si)7440-21-30.0224320.8000000.295781
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0140200.5000000.184863
Base Alloy Total2.77147498.84000036.543697
Lead FramePure metal layerNickel (Ni)7440-02-00.0280401.0000000.369726
Pre-Plating 1 Total0.0280401.0000000.369726
Lead FramePure metal layerPalladium (Pd)7440-05-30.0028040.1000000.036973
Pre-Plating 2 Total0.0028040.1000000.036973
Lead FramePure metal layerGold (Au)7440-57-50.0016820.0600000.022178
Pre-Plating 3 Total0.0016820.0600000.022178
Lead Frame Total2.804000100.00000036.972574
Mould CompoundFillerSilica fused60676-86-03.66999086.15000048.391218
Mould CompoundPolymerEpoxy resin system0.3693428.6700004.870016
Mould CompoundHardenerPhenolic resin0.1827544.2900002.409731
Mould CompoundAdditiveNon-declarable0.0174660.4100000.230301
Mould CompoundFillerSilica7631-86-90.0123540.2900000.162895
Mould CompoundPigmentCarbon black1333-86-40.0080940.1900000.106725
Mould Compound Total4.260000100.00000056.170886
Post-PlatingTin solderTin (Sn)7440-31-50.16989899.9400002.240216
Post-PlatingImpurityNon-declarable0.0000940.0555000.001239
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000106
Post-Plating Total0.170000100.0000002.241561
WirePure metalCopper (Cu)7440-50-80.00999999.9900000.131844
WireImpurityNon-declarable0.0000010.0100000.000013
Wire Total0.010000100.0000000.131857
BC69-16PAS Total7.584000100.000000
Notes
Report created on 2025-04-14 14:52:58 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-04-14 14:52:58 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-04-14 14:52:58 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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