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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 BUK7Y25-80E

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934067423115BUK7Y25-80EXBUK7Y25-80ESOT669 (LFPAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 81608 ppm of the article. SCIP No. 73067ae5-0481-41f5-9748-43d9bd18d7c1.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 5795 ppm; substance 1333-86-4: 869 ppm; substance 7439-92-1: 81608 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 6375 ppm; substance 1309-64-4: 5795 ppm; substance 1333-86-4: 869 ppm; substance 7439-92-1: 81608 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2206 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-31.600000100.0000002.057878
Die Total1.600000100.0000002.057878
ClipCopper alloyCopper (Cu)7440-50-84.99000099.8000006.418006
ClipCopper alloyIron (Fe)7439-89-60.0075000.1500000.009646
ClipCopper alloyPhosphorus (P)7723-14-00.0025000.0500000.003216
Clip Total5.000000100.0000006.430868
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000048.666201
Lead FrameCopper alloyIron (Fe)7439-89-60.0568650.1500000.073138
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0151640.0400000.019503
Lead Frame Total37.910000100.00000048.758842
Mould CompoundFillerSilica fused60676-86-016.22160072.00000020.863794
Mould CompoundFillerSilica7631-86-91.4193906.3000001.825582
Mould CompoundPolymerEpoxy resin system1.3518006.0000001.738649
Mould CompoundAdditiveNon-declarable1.3067405.8000001.680695
Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-41.2166205.4000001.564785
Mould CompoundPolymerFormaldehyde, polymer with bromophenol and 2-(chloromethyl)oxirane68541-56-00.4956602.2000000.637505
Mould CompoundFlame retardantAntimony trioxide (Sb2O3)1309-64-40.4506002.0000000.579550
Mould CompoundPigmentCarbon black1333-86-40.0675900.3000000.086932
Mould Compound Total22.530000100.00000028.977492
Post-PlatingTin alloyTin (Sn)7440-31-53.84961599.9900004.951274
Post-PlatingImpurityNon-declarable0.0003850.0100000.000495
Post-Plating Total3.850000100.0000004.951769
Solder Paste 1Lead alloyLead (Pb)7439-92-14.87475092.5000006.269775
Solder Paste 1Lead alloyTin (Sn)7440-31-50.2635005.0000000.338907
Solder Paste 1Lead alloySilver (Ag)7440-22-40.1317502.5000000.169453
Solder Paste Total5.270000100.0000006.778135
Solder Paste 1 Total5.270000100.0000006.778135
Solder Paste 2Lead alloyLead (Pb)7439-92-11.47027392.4700001.891026
Solder Paste 2Lead alloyTin (Sn)7440-31-50.0795005.0000000.102251
Solder Paste 2Lead alloySilver (Ag)7440-22-40.0397502.5000000.051125
Solder Paste 2ImpurityAntimony (Sb)7440-36-00.0004770.0300000.000614
Solder Paste Total1.590000100.0000002.045016
Solder Paste 2 Total1.590000100.0000002.045016
BUK7Y25-80E Total77.750000100.000000
Notes
Report created on 2025-03-14 14:41:18 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-03-14 14:41:18 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)??????
夾子 (Clip)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
錫膏 (Solder Paste)??????
錫膏 (Solder Paste)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-03-14 14:41:18 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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