化學成分 BUK9K35-60E

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934066977115	BUK9K35-60E,115	BUK9K35-60E	SOT1205 (LFPAK56D)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 27949 ppm of the article. SCIP No. 41343284-f900-47cb-8264-bf9d6ed282fd.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 8254 ppm; substance 1333-86-4: 1238 ppm; substance 7439-92-1: 27949 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 9079 ppm; substance 1309-64-4: 8254 ppm; substance 1333-86-4: 1238 ppm; substance 7439-92-1: 27949 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 756 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	1.660000	100.000000	2.101606
		Die Total		1.660000	100.000000	2.101606

Clip	Copper alloy	Copper (Cu)	7440-50-8	4.999980	99.800000	6.330114
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.007515	0.150000	0.009514
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.002505	0.050000	0.003172
		Clip Total		5.010000	100.000000	6.342800

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	35.329200	99.800000	44.727753
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.053100	0.150000	0.067226
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.017700	0.050000	0.022409
		Lead Frame Total		35.400000	100.000000	44.817388

Mould Compound	Filler	Silica fused	60676-86-0	23.472000	72.000000	29.716207
Mould Compound	Filler	Silica	7631-86-9	2.053800	6.300000	2.600168
Mould Compound	Polymer	Epoxy resin system		1.956000	6.000000	2.476351
Mould Compound	Additive	Non-declarable		1.890800	5.800000	2.393806
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	1.760400	5.400000	2.228716
Mould Compound	Polymer	Formaldehyde, polymer with bromophenol and 2-(chloromethyl)oxirane	68541-56-0	0.717200	2.200000	0.907995
Mould Compound	Flame retardant	Antimony trioxide (Sb2O3)	1309-64-4	0.652000	2.000000	0.825450
Mould Compound	Pigment	Carbon black	1333-86-4	0.097800	0.300000	0.123817
		Mould Compound Total		32.600000	100.000000	41.272510

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	1.929807	99.990000	2.443190
Post-Plating	Impurity	Non-declarable		0.000193	0.010000	0.000244
		Post-Plating Total		1.930000	100.000000	2.443434

Solder Paste 2	Lead alloy	Lead (Pb)	7439-92-1	1.586045	92.470000	2.007977
Solder Paste 2	Lead alloy	Tin (Sn)	7440-31-5	0.085760	5.000000	0.108575
Solder Paste 2	Lead alloy	Silver (Ag)	7440-22-4	0.042880	2.500000	0.054287
Solder Paste 2	Impurity	Antimony (Sb)	7440-36-0	0.000515	0.030000	0.000652
		Solder Paste Total		1.715200	100.000000	2.171491
		Solder Paste 2 Total		1.715200	100.000000	2.171491

Solder Paste 1	Lead alloy	Lead (Pb)	7439-92-1	0.621600	92.500000	0.786963
Solder Paste 1	Lead alloy	Tin (Sn)	7440-31-5	0.033600	5.000000	0.042539
Solder Paste 1	Lead alloy	Silver (Ag)	7440-22-4	0.016800	2.500000	0.021269
		Solder Paste Total		0.672000	100.000000	0.850771
		Solder Paste 1 Total		0.672000	100.000000	0.850771

		BUK9K35-60E Total		78.987200		100.000000

Notes
Report created on 2025-03-14 14:41:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-14 14:41:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-14 14:41:25 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車

所有應用

汽車

工業(yè)和電力

移動和可穿戴應用

計算和消費電子

Sub-systems: Power conversion topologies

子系統(tǒng)

參考設計

評估板

Interactive application notes

Advanced Support Tools

化學成分 BUK9K35-60E

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 BUK9K35-60E

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護