化學(xué)成分 NSF040120D7A0

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評(píng)估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934667390118	NSF040120D7A0J	NSF040120D7A0	SOT8070-1 (TO263-7L)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 3543 ppm of the article. SCIP No. 4a5d14fb-3519-47c5-a4ba-242e0b3aeae0.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 3543 ppm; substance 7440-02-0: 109 ppm; substance 1333-86-4: 2043 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 3543 ppm; substance 7440-02-0: 109 ppm; substance 1333-86-4: 2043 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 57 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Chip Coat	Polymer	3-Aminopropyltrihydroxysilane	58160-99-9	0.000010	100.000000	0.000001
		Chip Coat Total		0.000010	100.000000	0.000001

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	5.329500	93.500000	0.354378
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.285000	5.000000	0.018951
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.085500	1.500000	0.005685
		Solder Wire Total		5.700000	100.000000	0.379014

Die	Doped silicon carbide	Silicon carbide (SiC)	409-21-2	1.727000	100.000000	0.114835
		Die Total		1.727000	100.000000	0.114835

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	859.785129	99.858900	57.170299
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.706881	0.082100	0.047003
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.223860	0.026000	0.014885
Lead Frame	Nickel alloy	Phosphorus (P)	7723-14-0	0.120540	0.014000	0.008015
Lead Frame	Nickel alloy	Nickel (Ni)	7440-02-0	0.086100	0.010000	0.005725
		Base Alloy Total		860.922510	99.991000	57.245927
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.077490	0.009000	0.005153
		Pre-Plating Total		0.077490	0.009000	0.005153
		Lead Frame Total		861.000000	100.000000	57.251080

Mould Compound	Filler	Silica fused	60676-86-0	460.942500	75.000000	30.649775
Mould Compound	Filler	Silica	7631-86-9	92.188500	15.000000	6.129955
Mould Compound	Polymer	Epoxy resin system		46.094250	7.500000	3.064977
Mould Compound	Polymer	Phenolic resin		12.291800	2.000000	0.817327
Mould Compound	Pigment	Carbon black	1333-86-4	3.072950	0.500000	0.204332
		Mould Compound Total		614.590000	100.000000	40.866366

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	14.298570	99.990000	0.950765
Post-Plating	Impurity	Non-declarable		0.001430	0.010000	0.000095
		Post-Plating Total		14.300000	100.000000	0.950860

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	6.289940	99.990000	0.418241
Wire 2	Impurity	Nickel (Ni)	7440-02-0	0.000377	0.006000	0.000025
Wire 2	Impurity	Copper (Cu)	7440-50-8	0.000063	0.001000	0.000005
Wire 2	Impurity	Iron (Fe)	7439-89-6	0.000063	0.001000	0.000004
Wire 2	Impurity	Silicon (Si)	7440-21-3	0.000063	0.001000	0.000004
Wire 2	Impurity	Magnesium (Mg)	7439-95-4	0.000063	0.001000	0.000004
		Wire Total		6.290569	100.000000	0.418283
		Wire 2 Total		6.290569	100.000000	0.418283

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	0.294150	99.990000	0.019559
Wire 1	Impurity	Nickel (Ni)	7440-02-0	0.000018	0.006000	0.000001
Wire 1	Impurity	Iron (Fe)	7439-89-6	0.000003	0.001000	0.000001
Wire 1	Impurity	Silicon (Si)	7440-21-3	0.000003	0.001000	0.000000
Wire 1	Impurity	Copper (Cu)	7440-50-8	0.000003	0.001000	0.000000
Wire 1	Impurity	Magnesium (Mg)	7439-95-4	0.000003	0.001000	0.000000
		Wire Total		0.294180	100.000000	0.019561
		Wire 1 Total		0.294180	100.000000	0.019561

		NSF040120D7A0 Total		1503.901759	100.000000	100.000000

Notes
Report created on 2024-12-21 22:21:37 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
245 °C	40 s	220 °C	30 s	3

Notes
Report created on 2024-12-21 22:21:37 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
芯片涂層 (Chip Coat)	?	?	?	?	?	?
焊錫絲 (Solder Wire)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層 (Pre-Plating)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:21:36 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 NSF040120D7A0

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