化學(xué)成分 NX1029X

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934065643115	NX1029X,115	NX1029X	SOT666 (SOT6)	RFS	1
934065643125	NX1029XH	NX1029X	SOT666 (SOT6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 145965 ppm; substance 7440-48-4: 1742 ppm; substance 1333-86-4: 1575 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 145965 ppm; substance 7440-48-4: 1742 ppm; substance 1333-86-4: 1575 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 6935 ppm; substance 7440-22-4: 13817 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.045515	91.030000	1.627987
		Die Total		0.045515	91.030000	1.627987
Die 2	Pure metal layer	Aluminium (Al)	7429-90-5	0.001270	2.540000	0.045426
		Die Metallization 3 Total		0.001270	2.540000	0.045426
Die 2	Pure metal layer	Gold (Au)	7440-57-5	0.003215	6.430000	0.114995
		Die Metallization 4 Total		0.003215	6.430000	0.114995
		Die 2 Total		0.050000	100.000000	1.788408

Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	1.302390
		Die Total		0.036412	91.030000	1.302390
Die 1	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.036340
		Die Metallization 1 Total		0.001016	2.540000	0.036340
Die 1	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.091996
		Die Metallization 2 Total		0.002572	6.430000	0.091996
		Die 1 Total		0.040000	100.000000	1.430726

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.541720	46.700000	19.376325
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.408088	35.180000	14.596555
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.009744	0.840000	0.348525
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.004872	0.420000	0.174262
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.002900	0.250000	0.103728
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.002436	0.210000	0.087131
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.000928	0.080000	0.033193
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000464	0.040000	0.016597
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000232	0.020000	0.008298
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000232	0.020000	0.008298
		Base Alloy Total		0.971616	83.760000	34.752912
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.149756	12.910000	5.356496
		Pre-Plating 1 Total		0.149756	12.910000	5.356496
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.038628	3.330000	1.381652
		Pre-Plating 2 Total		0.038628	3.330000	1.381652
		Lead Frame Total		1.160000	100.000000	41.491060

Mould Compound	Filler	Silica fused	60676-86-0	1.042621	71.000000	37.292622
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.289291	19.700000	10.347390
Mould Compound	Polymer	Phenolic resin		0.132163	9.000000	4.727234
Mould Compound	Pigment	Carbon black	1333-86-4	0.004405	0.300000	0.157574
		Mould Compound Total		1.468480	100.000000	52.524820

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.063694	99.990000	2.278204
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000002	0.005000	0.000114
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000002	0.003000	0.000068
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000001	0.001000	0.000023
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000001	0.001000	0.000023
		Post-Plating Total		0.063700	100.000000	2.278432

Wire	Pure metal	Gold (Au)	7440-57-5	0.013602	99.990000	0.486506
Wire	Impurity	Non-declarable		0.000001	0.010000	0.000048
		Wire Total		0.013603	100.000000	0.486554

		NX1029X Total		2.795783	100.000000	100.000000

Notes
Report created on 2024-12-21 22:21:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:21:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層3 (Die Metallization 3)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層4 (Die Metallization 4)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:21:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

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MOSFET

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子系統(tǒng)

參考設(shè)計(jì)

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Interactive application notes

Advanced Support Tools

化學(xué)成分 NX1029X

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 NX1029X

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)