化學(xué)成分 NX3008CBKV

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評(píng)估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934065634115	NX3008CBKV,115	NX3008CBKV	SOT666 (SOT6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 146470 ppm; substance 7440-48-4: 1748 ppm; substance 1333-86-4: 1581 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 146470 ppm; substance 7440-48-4: 1748 ppm; substance 1333-86-4: 1581 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 6860 ppm; substance 7440-22-4: 13864 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	1.306893
		Die Total		0.036412	91.030000	1.306893
Die 1	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.036466
		Die Metallization 1 Total		0.001016	2.540000	0.036466
Die 1	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.092314
		Die Metallization 2 Total		0.002572	6.430000	0.092314
		Die 1 Total		0.040000	100.000000	1.435673

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	1.306893
		Die Total		0.036412	91.030000	1.306893
Die 2	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.036466
		Die Metallization 3 Total		0.001016	2.540000	0.036466
Die 2	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.092314
		Die Metallization 4 Total		0.002572	6.430000	0.092314
		Die 2 Total		0.040000	100.000000	1.435673

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.541720	46.700000	19.443325
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.408088	35.180000	14.647027
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.009744	0.840000	0.349730
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.004872	0.420000	0.174865
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.002900	0.250000	0.104086
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.002436	0.210000	0.087432
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.000928	0.080000	0.033308
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000464	0.040000	0.016654
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000232	0.020000	0.008327
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000232	0.020000	0.008327
		Base Alloy Total		0.971616	83.760000	34.873081
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.149756	12.910000	5.375018
		Pre-Plating 1 Total		0.149756	12.910000	5.375018
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.038628	3.330000	1.386430
		Pre-Plating 2 Total		0.038628	3.330000	1.386430
		Lead Frame Total		1.160000	100.000000	41.634529

Mould Compound	Filler	Silica fused	60676-86-0	1.042621	71.000000	37.421581
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.289291	19.700000	10.383185
Mould Compound	Polymer	Phenolic resin		0.132163	9.000000	4.743573
Mould Compound	Pigment	Carbon black	1333-86-4	0.004405	0.300000	0.158103
		Mould Compound Total		1.468480	100.000000	52.706442

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.063694	99.990000	2.286094
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000002	0.005000	0.000072
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000002	0.003000	0.000072
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000001	0.001000	0.000036
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000001	0.001000	0.000036
		Post-Plating Total		0.063700	100.000000	2.286310

Wire	Pure metal	Gold (Au)	7440-57-5	0.013968	99.990000	0.501337
Wire	Impurity	Non-declarable		0.000001	0.010000	0.000036
		Wire Total		0.013969	100.000000	0.501373

		NX3008CBKV Total		2.786149		100.000000

Notes
Report created on 2025-03-21 15:04:44 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-21 15:04:44 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層3 (Die Metallization 3)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層4 (Die Metallization 4)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-21 15:04:44 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 NX3008CBKV

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

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化學(xué)成分 NX3008CBKV

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