化學成分 PIMC32PA

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934666066115	PIMC32PAX	PIMC32PA	SOT1118 (HUSON6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14946 ppm; substance 1333-86-4: 2761 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14946 ppm; substance 1333-86-4: 2761 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8864 ppm; substance 7440-05-3: 269 ppm; substance 7440-57-5: 5008 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.062400	80.000000	0.886399
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.007800	10.000000	0.110800
Adhesive	Polymer	Bismaleimide resin		0.006825	8.750000	0.096950
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000780	1.000000	0.011080
Adhesive	Polymer	Acrylic resin		0.000187	0.240000	0.002656
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000008	0.010000	0.000114
		Adhesive Total		0.078000	100.000000	1.107999

Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.092000	100.000000	1.306870
		Die Total		0.092000	100.000000	1.306870
		Die 1 Total		0.092000	100.000000	1.306870

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.092000	100.000000	1.306870
		Die Total		0.092000	100.000000	1.306870
		Die 2 Total		0.092000	100.000000	1.306870

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.559410	95.110000	36.356702
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.085305	3.170000	1.211767
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.018568	0.690000	0.263761
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.005382	0.200000	0.076452
		Base Alloy Total		2.668665	99.170000	37.908682
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000538	0.020000	0.007642
		Pre-Plating 1 Total		0.000538	0.020000	0.007642
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.001884	0.070000	0.026762
		Pre-Plating 2 Total		0.001884	0.070000	0.026762
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.019913	0.740000	0.282866
		Pre-Plating 3 Total		0.019913	0.740000	0.282866
		Lead Frame Total		2.691000	100.000000	38.225952

Mould Compound	Filler	Silica fused	60676-86-0	2.332800	60.000000	33.137682
Mould Compound	Filler	Silica	7631-86-9	0.894240	23.000000	12.702778
Mould Compound	Polymer	Epoxy resin system		0.272160	7.000000	3.866063
Mould Compound	Polymer	Phenolic resin		0.233280	6.000000	3.313768
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.116640	3.000000	1.656884
Mould Compound	Pigment	Carbon black	1333-86-4	0.019440	0.500000	0.276147
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.019440	0.500000	0.276147
		Mould Compound Total		3.888000	100.000000	55.229469

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.163902	99.940000	2.328246
Post-Plating	Impurity	Non-declarable		0.000091	0.055500	0.001293
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000007	0.004500	0.000099
		Post-Plating Total		0.164000	100.000000	2.329638

Wire	Pure metal	Gold (Au)	7440-57-5	0.034717	99.990000	0.493159
Wire	Impurity	Non-declarable		0.000003	0.010000	0.000043
		Wire Total		0.034720	100.000000	0.493202

		PIMC32PA Total		7.039720		100.000000

Notes
Report created on 2025-03-24 13:59:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-24 13:59:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-24 13:59:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

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所有應用

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Sub-systems: Power conversion topologies

子系統(tǒng)

參考設計

評估板

Interactive application notes

Advanced Support Tools

化學成分 PIMC32PA

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 PIMC32PA

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護