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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 PMCXB900UEL

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導體已決定直接通過互聯(lián)網發(fā)布其產品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934070417147PMCXB900UELZPMCXB900UELSOT1216 (DFN1010B-6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 30378 ppm; substance 1333-86-4: 2489 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 30378 ppm; substance 1333-86-4: 2489 ppm; substance 7439-92-1: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 14461 ppm; substance 7440-05-3: 1736 ppm; substance 7440-57-5: 11829 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.01760080.0000001.446115
AdhesivePolymerPoly(isobornyl) methacrylate64114-51-80.00220010.0000000.180764
AdhesivePolymerBismaleimide resin0.0019258.7500000.158169
AdhesivePolymerPolysiloxanes63148-53-80.0002201.0000000.018077
AdhesivePolymerAcrylic resin0.0000530.2400000.004355
AdhesiveCuring accelerators/CatalystPalladium (Pd)7440-05-30.0000020.0100000.000164
Adhesive Total0.022000100.0000001.807644
Die 1Doped siliconSilicon (Si)7440-21-30.030000100.0000002.464969
Die Total0.030000100.0000002.464969
Die 1 Total0.030000100.0000002.464969
Die 2Doped siliconSilicon (Si)7440-21-30.030000100.0000002.464969
Die Total0.030000100.0000002.464969
Die 2 Total0.030000100.0000002.464969
Lead FrameCopper alloyCopper (Cu)7440-50-80.44769491.18000036.785056
Lead FrameCopper alloyNickel (Ni)7440-02-00.0139442.8400001.145718
Lead FrameCopper alloySilicon (Si)7440-21-30.0030440.6200000.250112
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0008350.1700000.068608
Base Alloy Total0.46551794.81000038.249494
Lead FramePure metal layerGold (Au)7440-57-50.0003440.0700000.028265
Pre-Plating 1 Total0.0003440.0700000.028265
Lead FramePure metal layerPalladium (Pd)7440-05-30.0021110.4300000.173452
Pre-Plating 2 Total0.0021110.4300000.173452
Lead FramePure metal layerNickel (Ni)7440-02-00.0230284.6900001.892110
Pre-Plating 3 Total0.0230284.6900001.892110
Lead Frame Total0.491000100.00000040.343321
Mould CompoundFillerSilica fused60676-86-00.36360060.00000029.875420
Mould CompoundFillerSilica7631-86-90.13938023.00000011.452244
Mould CompoundPolymerEpoxy resin system0.0424207.0000003.485466
Mould CompoundPolymerPhenolic resin0.0363606.0000002.987542
Mould CompoundFlame retardantAluminium hydroxide (Al(OH)3)21645-51-20.0181803.0000001.493771
Mould CompoundPigmentCarbon black1333-86-40.0030300.5000000.248962
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0030300.5000000.248962
Mould Compound Total0.606000100.00000049.792367
Post-PlatingTin solderTin (Sn)7440-31-50.02398699.9400001.970825
Post-PlatingImpurityNon-declarable0.0000130.0555000.001068
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000082
Post-Plating Total0.024000100.0000001.971975
WirePure metalGold (Au)7440-57-50.01405399.9900001.154673
WireImpurityNon-declarable0.0000010.0100000.000082
Wire Total0.014054100.0000001.154755
PMCXB900UEL Total1.217054100.000000
Notes
Report created on 2025-03-24 13:59:24 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-03-24 13:59:24 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導體芯片 (Die)??????
半導體芯片 (Die)??????
基底合金 (Base Alloy)??????
預鍍層1 (Pre-Plating 1)??????
預鍍層2 (Pre-Plating 2)??????
預鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導線 (Wire)??????
? 表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-03-24 13:59:24 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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