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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PMDPB95XNE2

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934068837115PMDPB95XNE2XPMDPB95XNE2SOT1118 (HUSON6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14707 ppm; substance 1333-86-4: 2717 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14707 ppm; substance 1333-86-4: 2717 ppm; substance 7439-92-1: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8722 ppm; substance 7440-57-5: 4715 ppm; substance 7440-05-3: 263 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.872215
AdhesivePolymerAcrylic resin0.01560020.0000000.218054
Adhesive Total0.078000100.0000001.090269
DieDoped siliconSilicon (Si)7440-21-30.300000100.0000004.193341
Die Total0.300000100.0000004.193341
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000035.774930
Lead FrameCopper alloyNickel (Ni)7440-02-00.0853053.1700001.192372
Lead FrameCopper alloySilicon (Si)7440-21-30.0185680.6900000.259538
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0053820.2000000.075229
Base Alloy Total2.66866599.17000037.302069
Lead FramePure metal layerGold (Au)7440-57-50.0005380.0200000.007523
Pre-Plating 1 Total0.0005380.0200000.007523
Lead FramePure metal layerNickel (Ni)7440-02-00.0199130.7400000.278346
Pre-Plating 2 Total0.0199130.7400000.278346
Lead FramePure metal layerPalladium (Pd)7440-05-30.0018840.0700000.026330
Pre-Plating 3 Total0.0018840.0700000.026330
Lead Frame Total2.691000100.00000037.614268
Mould CompoundFillerSilica fused60676-86-02.33280060.00000032.607420
Mould CompoundFillerSilica7631-86-90.89424023.00000012.499511
Mould CompoundPolymerEpoxy resin system0.2721607.0000003.804199
Mould CompoundPolymerPhenolic resin0.2332806.0000003.260742
Mould CompoundFlame retardantAluminium hydroxide (Al(OH)3)21645-51-20.1166403.0000001.630371
Mould CompoundPigmentCarbon black1333-86-40.0194400.5000000.271728
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0194400.5000000.271728
Mould Compound Total3.888000100.00000054.345699
Post-PlatingTin solderTin (Sn)7440-31-50.16390299.9400002.290985
Post-PlatingImpurityNon-declarable0.0000910.0555000.001272
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000103
Post-Plating Total0.164000100.0000002.292360
WirePure metalGold (Au)7440-57-50.03319799.9900000.464017
WireImpurityNon-declarable0.0000030.0100000.000046
Wire Total0.033200100.0000000.464063
PMDPB95XNE2 Total7.154200100.000000100.000000
Notes
Report created on 2024-12-21 22:24:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:24:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:24:30 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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