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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PMPB33XN

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934066869115PMPB33XN,115PMPB33XNSOT1220 (DFN2020MD-6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 24257 ppm; substance 1333-86-4: 2635 ppm; substance 7439-92-1: 1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 24257 ppm; substance 1333-86-4: 2635 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 7913 ppm; substance 7440-57-5: 8245 ppm; substance 7440-05-3: 1143 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.791306
AdhesivePolymerAcrylic resin0.01400020.0000000.197827
Adhesive Total0.070000100.0000000.989133
DieDoped siliconSilicon (Si)7440-21-30.15955299.7200002.254544
DiePure metal layerAluminium (Al)7429-90-50.0004480.2800000.006330
Die Metallization Total0.0004480.2800000.006330
Die Total0.160000100.0000002.260874
Lead FrameCopper alloyCopper (Cu)7440-50-82.68654492.96000037.962116
Lead FrameCopper alloyNickel (Ni)7440-02-00.0838102.9000001.184274
Lead FrameCopper alloySilicon (Si)7440-21-30.0182070.6300000.257273
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0040460.1400000.057172
Base Alloy Total2.79260796.63000039.460835
Lead FramePure metal layerGold (Au)7440-57-50.0014450.0500000.020418
Pre-Plating 1 Total0.0014450.0500000.020418
Lead FramePure metal layerPalladium (Pd)7440-05-30.0080920.2800000.114344
Pre-Plating 2 Total0.0080920.2800000.114344
Lead FramePure metal layerNickel (Ni)7440-02-00.0878563.0400001.241446
Pre-Plating 3 Total0.0878563.0400001.241446
Lead Frame Total2.890000100.00000040.837043
Mould CompoundFillerSilica fused60676-86-02.23800060.00000031.623981
Mould CompoundFillerSilica7631-86-90.85790023.00000012.122526
Mould CompoundPolymerEpoxy resin system0.2611007.0000003.689464
Mould CompoundPolymerPhenolic resin0.2238006.0000003.162398
Mould CompoundFlame retardantAluminium hydroxide (Al(OH)3)21645-51-20.1119003.0000001.581199
Mould CompoundPigmentCarbon black1333-86-40.0186500.5000000.263533
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0186500.5000000.263533
Mould Compound Total3.730000100.00000052.706634
Post-PlatingTin solderTin (Sn)7440-31-50.16989899.9400002.400738
Post-PlatingImpurityNon-declarable0.0000940.0555000.001333
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000108
Post-Plating Total0.170000100.0000002.402179
Wire 1Pure metalGold (Au)7440-57-50.050028100.0000000.706919
Wire Total0.050028100.0000000.706919
Wire 1 Total0.050028100.0000000.706919
Wire 2Pure metalGold (Au)7440-57-50.00687999.9900000.097208
Wire 2ImpurityNon-declarable0.0000010.0100000.000010
Wire Total0.006880100.0000000.097218
Wire 2 Total0.006880100.0000000.097218
PMPB33XN Total7.076908100.000000100.000000
Notes
Report created on 2024-12-21 22:25:27 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:25:27 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
半導(dǎo)體芯片金屬化層 (Die Metallization)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
導(dǎo)線 (Wire)??????
導(dǎo)線 (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:25:27 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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