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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 PNU65030EP-Q

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934664833115PNU65030EP-QXPNU65030EP-QSOD128 (FlatPower)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 70349 ppm of the article. SCIP No. e69b8273-820f-4c43-8ec6-8b54a5b7d316.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1114 ppm; substance 7439-92-1: 70349 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1114 ppm; substance 7439-92-1: 70349 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 7115 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-30.775000100.0000002.357629
Die Total0.775000100.0000002.357629
ClipCopper alloyCopper (Cu)7440-50-85.20969699.86000015.848431
ClipCopper alloyIron (Fe)7439-89-60.0052170.1000000.015871
ClipCopper alloyPhosphorus (P)7723-14-00.0020870.0400000.006348
Clip Total5.217000100.00000015.870650
Lead FrameCopper alloyCopper (Cu)7440-50-811.63324498.42000035.389523
Lead FrameCopper alloyIron (Fe)7439-89-60.0118200.1000000.035958
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0035460.0300000.010787
Base Alloy Total11.64861098.55000035.436268
Lead FramePure metal layerSilver (Ag)7440-22-40.1713901.4500000.521386
Pre-Plating Total0.1713901.4500000.521386
Lead Frame Total11.820000100.00000035.957654
Mould CompoundFillerSilica fused60676-86-09.15750075.00000027.858056
Mould CompoundFillerSilica7631-86-91.22100010.0000003.714407
Mould CompoundPolymerEpoxy resin system0.9401707.7000002.860094
Mould CompoundPolymerPhenolic resin0.8547007.0000002.600085
Mould CompoundPigmentCarbon black1333-86-40.0366300.3000000.111432
Mould Compound Total12.210000100.00000037.144074
Post-PlatingTin solderTin (Sn)7440-31-50.34996699.9900001.064629
Post-PlatingImpurityLead (Pb)7439-92-10.0000180.0050000.000053
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000100.0030000.000032
Post-PlatingImpurityCopper (Cu)7440-50-80.0000030.0010000.000011
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000030.0010000.000011
Post-Plating Total0.350000100.0000001.064736
Solder PasteLead alloyLead (Pb)7439-92-12.31250092.5000007.034863
Solder PasteLead alloyTin (Sn)7440-31-50.1250005.0000000.380263
Solder PasteLead alloySilver (Ag)7440-22-40.0625002.5000000.190131
Solder Paste Total2.500000100.0000007.605257
PNU65030EP-Q Total32.872000100.000000100.000000
Notes
Report created on 2024-12-21 22:25:48 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-21 22:25:48 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導體芯片 (Die)??????
夾子 (Clip)??????
基底合金 (Base Alloy)??????
預鍍層 (Pre-Plating)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
錫膏 (Solder Paste)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:25:48 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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