74LVC1G332-Q100
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G332GV-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 261 | 63 | 172 | TSOP6 |
| 74LVC1G332GW-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 284 | 56.2 | 172 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G332GV-Q100 | 74LVC1G332GV-Q100H (935304365125) |
Active | YG |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74LVC1G332GW-Q100 | 74LVC1G332GW-Q100H (935304346125) |
Active | YG |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G332GV-Q100 | 74LVC1G332GV-Q100H | 74LVC1G332GV-Q100 |
|
|
| 74LVC1G332GW-Q100 | 74LVC1G332GW-Q100H | 74LVC1G332GW-Q100 |
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文檔 (17)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G332_Q100 | Single 3-input OR gate | Data sheet | 2023-08-18 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| 001aad933 | Block diagram: 74AUP1G332GF, 74AUP1G332GM, 74AUP1G332GW, 74LVC1G332GF, 74LVC1G332GM, 74LVC1G332GV, 74LVC1G332GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g332 | 74LVC1G332 IBIS model | IBIS model | 2015-09-06 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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