NXS0102
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0102DC | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 5.2 | 2 | low | -40~125 | 169 | 10.6 | 76 | VSSOP8 | Bi-directional | AutoSense |
| NXS0102GT | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 5.2 | 2 | low | -40~125 | 169 | 10.6 | 76 | XSON8 | Bi-directional | AutoSense |
| NXS0102UN | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 5.2 | 2 | low | -40~125 | 139 | 12 | WLCSP8 | Bi-directional | AutoSense |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0102DC | NXS0102DCH (935690905125) |
Active | m2 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| NXS0102GT | NXS0102GTX (935690913115) |
Active | m2 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
| NXS0102UN | NXS0102UNAZ (935691106336) |
Active | m2 |
WLCSP8 (SOT8023-1) |
SOT8023-1 | SOT8023-1_336 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0102UN | NXS0102UNZ (935691106084) |
Withdrawn / End-of-life | m2 |
WLCSP8 (SOT8023-1) |
SOT8023-1 | 暫無信息 |
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXS0102 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2023-11-16 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT8023-1 | 3D model for products with SOT8023-1 package | Design support | 2023-02-07 |
| nxs0102 | NXS0102 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | Package information | 2022-04-20 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT8023-1 | 3D model for products with SOT8023-1 package | Design support | 2023-02-07 |
| nxs0102 | NXS0102 IBIS model | IBIS model | 2020-11-05 |
樣品
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