74AHC1G04; 74AHCT1G04
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC1G04GM | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 322 | 164 | XSON6 |
| 74AHC1G04GV | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 282 | 177 | TSOP5 |
| 74AHC1G04GW | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 322 | 191 | TSSOP5 |
| 74AHCT1G04GM | 4.5?-?5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 322 | 164 | XSON6 |
| 74AHCT1G04GV | 4.5?-?5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 282 | 177 | TSOP5 |
| 74AHCT1G04GW | 4.5?-?5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 322 | 191 | TSSOP5 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC1G04GM | 74AHC1G04GM,115 (935297565115) |
Active | AC |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74AHC1G04GM,132 (935297565132) |
Active | AC | SOT886_132 | ||||
| 74AHC1G04GV | 74AHC1G04GV,125 (935271653125) |
Active | A04 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHC1G04GW | 74AHC1G04GW,125 (935262753125) |
Active | AC |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AHCT1G04GM | 74AHCT1G04GM,132 (935297566132) |
Active | CC |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_132 |
| 74AHCT1G04GM,115 (935297566115) |
Active | CC | SOT886_115 | ||||
| 74AHCT1G04GV | 74AHCT1G04GV,125 (935271652125) |
Active | C04 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHCT1G04GW | 74AHCT1G04GW,125 (935262752125) |
Active | CC |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC1G04GM | 74AHC1G04GM,115 | 74AHC1G04GM |
|
|
| 74AHC1G04GM | 74AHC1G04GM,132 | 74AHC1G04GM |
|
|
| 74AHC1G04GV | 74AHC1G04GV,125 | 74AHC1G04GV |
|
|
| 74AHC1G04GW | 74AHC1G04GW,125 | 74AHC1G04GW |
|
|
| 74AHCT1G04GM | 74AHCT1G04GM,132 | 74AHCT1G04GM |
|
|
| 74AHCT1G04GM | 74AHCT1G04GM,115 | 74AHCT1G04GM |
|
|
| 74AHCT1G04GV | 74AHCT1G04GV,125 | 74AHCT1G04GV |
|
|
| 74AHCT1G04GW | 74AHCT1G04GW,125 | 74AHCT1G04GW |
|
|
文檔 (22)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT1G04 | Inverter | Data sheet | 2024-11-12 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| mna108 | Block diagram: 74AUP1GU04GF, 74AUP1GU04GM, 74AUP1GU04GW, 74AHC1G04GV, 74AHC1G04GW, 74AHCT1G04GV, 74AHCT1G04GW, 74HC1G04GV, 74HC1G04GW, 74HCT1G04GV, 74HCT1G04GW, 74LVC1G04GF, 74LVC1G04GM, 74LVC1G04GV, 74LVC1G04GW, 74LVC1GU04GF, 74LVC1GU04GM, 74LVC1GU04GV, 74LVC1GU04GW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| ahc1g04 | ahc1g04 IBIS model | IBIS model | 2013-04-08 |
| ahct1g04 | ahct1g04 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| ahc1g04 | ahc1g04 IBIS model | IBIS model | 2013-04-08 |
| ahct1g04 | ahct1g04 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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