74AUP2G16
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | ||
|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G16GM | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | XSON6 | ||
| 74AUP2G16GW | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 264 | 153 | TSSOP6 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP2G16GM | 74AUP2G16GMH (935307548125) |
Active | 5A |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AUP2G16GW | 74AUP2G16GWH (935307547125) |
Active | 5A |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP2G16GF | 74AUP2G16GFH (935307549125) |
Obsolete | 5A |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
暫無信息 |
| 74AUP2G16GX | 74AUP2G16GXZ (935307653147) |
Obsolete | 5A According NX3-00133 According NX3-00133 |
X2SON6 (SOT1255) |
SOT1255 |
REFLOW_BG-BD-1
|
SOT1255_147 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G16GM | 74AUP2G16GMH | 74AUP2G16GM |
|
|
| 74AUP2G16GW | 74AUP2G16GWH | 74AUP2G16GW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G16GF | 74AUP2G16GFH | 74AUP2G16GF |
|
|
| 74AUP2G16GX | 74AUP2G16GXZ | 74AUP2G16GX |
|
|
文檔 (21)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP2G16 | Low-power dual buffer | Data sheet | 2023-07-26 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| aup2g16 | 74AUP2G16 IBIS model | IBIS model | 2015-10-30 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| X2SON6_SOT1255_mk | "plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body" | Marcom graphics | 2017-01-28 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-31 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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