74AXP1T32
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP1T32GM | 74AXP1T32GMX (935691217115) |
Obsolete | no package information | ||||
| 74AXP1T32GS | 74AXP1T32GSH (935691220125) |
Withdrawn / End-of-life | rT |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無(wú)信息 |
| 74AXP1T32GX | 74AXP1T32GXZ (935308977147) |
Withdrawn / End-of-life |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 | ||
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP1T32GM | 74AXP1T32GMX | 74AXP1T32GM |
|
|
| 74AXP1T32GS | 74AXP1T32GSH | 74AXP1T32GS |
|
|
| 74AXP1T32GX | 74AXP1T32GXZ | 74AXP1T32GX |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1T32 | Dual supply 2-input OR gate | Data sheet | 2022-02-28 |
| AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| axp1t32 | 74AXP1T32 IBIS Model | IBIS model | 2016-12-12 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
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Ordering, pricing & availability
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