外形圖
封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
OL-PMCM4401VNE | WLCSP4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | 2015-07-07 |
相關(guān)文檔
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
OL-PMCM4401VNE | 3D model for products with OL-PMCM4401VNE package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
OL-PMCM4401VNE | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | Package information | 2022-07-13 |
pmcm4401vne-ssmos_fr | pmcm4401vne-ssmos_fr | Reflow soldering | 2015-07-10 |
采用此封裝的產(chǎn)品
MOSFETs
型號 | 描述 | 快速訪問 |
---|---|---|
PMCM4401VNE | 12V, N-channel Trench MOSFET |
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