外形圖
封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
SOT109-1 | SO16 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | MS-012 (JEDEC) | 2023-10-27 |
相關(guān)文檔
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT109-1_112 | SO16; Tube pack; Standard product orientation | Packing information | 2021-09-10 |
SOT109-1_118 | SO16; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-02-19 |
SOT109-1_139 | SO16; Reel pack for SMD, 13"; Q4/T2 product orientation | Packing information | 2024-02-19 |
SOT109-1_431 | SO16; Reel sulfur barrier pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,431 or Z Ordering code (12NC) ending 431 | Packing information | 2020-04-27 |
SOT109-1_652 | SO16; Tube pack; Standard product orientation | Packing information | 2021-09-10 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
型號(hào) | 描述 | 快速訪問(wèn) |
---|---|---|
74LV138D-Q100 | 3-to-8 line decoder/demultiplexer; inverting |
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