外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1289B | CFP15B | plastic, thermal enhanced ultra thin SMD package; 3 leads; 2.13?mm pitch; 5.8 x 4.3 x 0.95 mm body | 2019-01-10 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT1289B | 3D model for products with SOT1289B package | Design support | 2020-01-22 |
| RS2624_CFP15BSide | RS2624_CFP15BSide | Marcom graphics | 2021-03-11 |
| SOT1289B | plastic, thermal enhanced ultra thin SMD package; 3leads; 2.13?mm pitch; 5.8 x 4.3 x 0.95 mm body | Package information | 2023-06-02 |
| SOT1289B_139 | CFP15B; Reel pack for SMD, 13"; Q4/T2 product orientation | Packing information | 2020-09-02 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PMEG100T100ELPE-Q | 100 V, 10 A low leakage current Trench Schottky barrier rectifier |
|