外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT402-1 | TSSOP14 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT402-1_118 | TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SOT402-1_623 | TSSOP14; Reel pack; SMD, 13"; Q1 Standard product orientation; Orderable part number ending, 623 or XP; Ordering code (12NC) ending 623 | Packing information | 2020-04-27 |
| SOT402-1_653 | TSSOP14; Reel pack; SMD, 13"; Q1 Standard product orientation; Orderable part number ending, 653 or HL; Ordering code (12NC) ending 653 | Packing information | 2020-04-27 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |