外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT519-1 | SSOP16 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | 2003-02-18 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT519-1_118 | SSOP16; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| CBT3257ADS | Quad 1-of-2 multiplexer/demultiplexer |
|