外形圖
封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
SOT8041-2 | HWQFN24 | Plastic thermal enhanced very very thin Quad Flat package, no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | 2024-12-16 |
相關(guān)文檔
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
SOT8041-2 | Plastic thermal enhanced very very thin Quad Flat package,no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | Package information | 2025-03-18 |
SOT8041-2_518 | HWQFN24; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-27 |
采用此封裝的產(chǎn)品
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型號(hào) | 描述 | 快速訪問 |
---|---|---|
NEX5204100BY | USB Type-C? and Power Delivery controller |