外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| WLCSP5_2-1-2 | WLCSP5 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | 2010-02-11 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PCMF1USB3S | Common-mode EMI filter for differential channels with integrated ESD protection |
|