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200 V, 3 A hyperfast PN-rectifier
High power density, hyperfast PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead CFP5 (SOD128) Surface-Mounted Device (SMD) plastic package.
Features and benefits
- Reverse voltage VR ≤ 200 V
- Forward current IF ≤ 3 A
- Hyperfast recovery time trr ≤ 25 ns
- Pt doped life time control
- Low inductance
- Small and flat lead SMD plastic package
- Package height typ. 1 mm
- High power capability due to clip-bond technology
- Planar die design
- Capable for reflow and wave soldering
Applications
- General-purpose rectification
- Reverse polarity protection
- Hyperfast switching
- Freewheeling applications
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | VR [max] (V) | IF(AV) per diode; [max] (A) | IFSM [max] (A) | VF [max] (mV) | IR [max] (μA) | Configuration | trr [max] (ns) | IF [max] (mA) | Cd [typ] (pF) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ES3DP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 200.0 | 3.0 | 60.0 | 980.0 | 0.2 | single | 25.0 | 4240.0 | 27.0 | N |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| ES3DP | ES3DPX (934070395115) |
Obsolete | DP |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| ES3DP | ES3DPX | ES3DP |
|
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文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| ES3DP | 200 V, 3 A hyperfast PN-rectifier | Data sheet | 2017-08-03 |
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封裝的肖特基整流器 | Leaflet | 2022-07-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| ES3DP | ES3DP SPICE model | SPICE model | 2016-12-01 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| ES3DP | ES3DP SPICE model | SPICE model | 2016-12-01 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
ES3DP
200 V, 3 A hyperfast PN-rectifier
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