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20 V, N-channel Trench MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Features and benefits
Very fast switching
Low threshold voltage
Trench MOSFET technology
Side wettable flanks for optical solder inspection
Exposed drain pad for excellent thermal conduction
Applications
Relay driver
High-speed line driver
Low-side load switch
Switching circuits
參數(shù)類型
型號(hào) | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | VGS [max] (V) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Ptot [max] (W) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMPB8XN | SOT1220 | DFN2020MD?6 | Production | N | 1 | 20 | 8 | 12 | 16 | 150 | 14.3 | 5.9 | 20 | 1.9 | 0.65 | N | 1696 | 224 | 2019-09-24 |
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
PMPB8XN | PMPB8XNX (934660517115) |
Discontinued / End-of-life | 5A |
DFN2020MD?6 (SOT1220) |
SOT1220 |
REFLOW_BG-BD-1
|
SOT1220_115 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
PMPB8XN | PMPB8XNX | PMPB8XN |
文檔 (13)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
PMPB8XN | 20 V, N-channel Trench MOSFET | Data sheet | 2019-09-24 |
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車 二極管和晶體管 | Brochure | 2022-04-26 |
SOT1220 | 3D model for products with SOT1220 package | Design support | 2018-08-23 |
nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN | 適合移動(dòng)和便攜式設(shè)備的 大批量小信號(hào)MOSFET, 采用WLCSP和無(wú)引腳DFN封裝 | Leaflet | 2022-07-04 |
nexperia_document_leaflet_SsMOS_for_mobile_2022 | High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages | Leaflet | 2022-07-04 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020MD-6_SOT1220_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1220 | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
nexperia_report_aoi_inspection_dfn_201808 | Automatic Optical Inspection of DFN Components | Report | 2018-09-03 |
PMPB8XN | SPICE Model PMPB8XN | SPICE model | 2020-01-08 |
支持
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.