CBT3306
參數(shù)類型
| 型號 | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CBT3306GT | 4.5?-?5.5 | 3.9 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 353 | 7.6 | 175 | XSON8 |
| CBT3306PW | 4.5?-?5.5 | 3.9 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | 120 | 30 | 87.5 | TSSOP8 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT3306GT | CBT3306GT,115 (935290813115) |
Active | F06 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
| CBT3306PW | CBT3306PW,118 (935270498118) |
Active | 3306 |
TSSOP8 (SOT530-1) |
SOT530-1 | SOT530-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT3306D | CBT3306D,112 (935270499112) |
Obsolete | CBT3306 |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暫無信息 |
| CBT3306D,118 (935270499118) |
Obsolete | CBT3306 | SOT96-1_118 | ||||
| CBT3306GM | CBT3306GM,125 (935290812125) |
Obsolete | F06 |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 |
文檔 (19)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| CBT3306 | Dual bus switch | Data sheet | 2024-06-06 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| 002aab985 | Block diagram: CBT3306D, CBT3306PW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| cbt3306 | cbt3306 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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