NPS4053
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NPS4053GH | NPS4053GHZ (935691293147) |
Active | s3 |
HWSON6 (SOT8044-1) |
SOT8044-1 | SOT8044-1_147 | |
| NPS4053GV | NPS4053GVH (935691286125) |
Active | s3 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
環(huán)境信息
品質(zhì)及可靠性免責聲明
文檔 (12)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| NPS4053 | 5.5 V, 55 mOhm load switch with precision adjustable current limit | Data sheet | 2023-10-20 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| nexperia_leaflet_electronics_power_management_load_switch | NPS4053 load switch leaflet | Leaflet | 2024-03-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT8044-1 | plastic thermal enhanced very very thin Small Outline packages, no leads;6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2023-12-04 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
樣品
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