BC55xPAS-Q series
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-10PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 420 | 60 | 1000 | 63 | 160 | 150 | 100 | Y |
| BC55-16PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 420 | 60 | 1000 | 100 | 250 | 150 | 100 | Y |
| BC55PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 420 | 60 | 1000 | 63 | 250 | 150 | 100 | Y |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC55-10PAS-Q | BC55-10PAS-QX (934666133115) |
Active | CH |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
| BC55-16PAS-Q | BC55-16PAS-QX (934666134115) |
Active | CJ |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
| BC55PAS-Q | BC55PAS-QX (934664895115) |
Active | CG |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC55-10PAS-Q | BC55-10PAS-QX | BC55-10PAS-Q |
|
|
| BC55-16PAS-Q | BC55-16PAS-QX | BC55-16PAS-Q |
|
|
| BC55PAS-Q | BC55PAS-QX | BC55PAS-Q |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BC55XPAS-Q_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2023-05-02 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車 二極管和晶體管 | Brochure | 2022-04-26 |
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Ordering, pricing & availability
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