NPIC6C596-Q100
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NPIC6C596BQ-Q100 | NPIC6C596BQ-Q100,1 (935298528115) |
Withdrawn / End-of-life |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | ||
| NPIC6C596D-Q100 | NPIC6C596D-Q100,11 (935298529118) |
Obsolete | no package information | ||||
| NPIC6C596PW-Q100 | NPIC6C596PW-Q100,1 (935298531118) |
Withdrawn / End-of-life |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 | |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NPIC6C596BQ-Q100 | NPIC6C596BQ-Q100,1 | NPIC6C596BQ-Q100 |
|
|
| NPIC6C596D-Q100 | NPIC6C596D-Q100,11 | NPIC6C596D-Q100 |
|
|
| NPIC6C596PW-Q100 | NPIC6C596PW-Q100,1 | NPIC6C596PW-Q100 |
|
|
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NPIC6C596_Q100 | Power logic 8-bit shift register; open-drain outputs | Data sheet | 2020-06-22 |
| AN11537 | Pin FMEA for NPIC Family | Application note | 2019-10-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| npic6c596 | NPIC6C596 IBIS model | IBIS model | 2016-05-30 |
| Nexperia_document_leaflet_Logic_NPIC_ShiftRegisters_201906 | NPIC Logic Shift Registers | Leaflet | 2019-07-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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