74HC166-Q100; 74HCT166-Q100
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC166D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 63 | low | -40~125 | 74 | 1.2 | 32 | SO16 |
| 74HC166PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 63 | low | -40~125 | 108 | 1 | 35.9 | TSSOP16 |
| 74HCT166D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 23 | 50 | low | -40~125 | 76 | 2.1 | 34 | SO16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC166D-Q100 | 74HC166D-Q100J (935301535118) |
Active | 74HC166D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC166PW-Q100 | 74HC166PW-Q100J (935301536118) |
Active | HC166 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT166D-Q100 | 74HCT166D-Q100J (935301537118) |
Active | 74HCT166D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC166D-Q100 | 74HC166D-Q100J | 74HC166D-Q100 |
|
|
| 74HC166PW-Q100 | 74HC166PW-Q100J | 74HC166PW-Q100 |
|
|
| 74HCT166D-Q100 | 74HCT166D-Q100J | 74HCT166D-Q100 |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74HC_HCT166_Q100 | 8-bit parallel-in/serial out shift register | Data sheet | 2024-03-11 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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