NXS0104-Q100
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0104BQ-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 96 | 12.8 | 64 | DHVQFN14 |
| NXS0104GU12-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 135 | 4.2 | 58 | XQFN12 |
| NXS0104PW-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 133 | 4.9 | 58 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0104BQ-Q100 | NXS0104BQ-Q100X (935690811115) |
Active | S0104 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXS0104GU12-Q100 | NXS0104GU12-Q100X (935691322115) |
Active |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | ||
| NXS0104PW-Q100 | NXS0104PW-Q100J (935690809118) |
Active | NXS0104 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0104BQ-Q100 | NXS0104BQ-Q100X | NXS0104BQ-Q100 |
|
|
| NXS0104GU12-Q100 | NXS0104GU12-Q100X | NXS0104GU12-Q100 |
|
|
| NXS0104PW-Q100 | NXS0104PW-Q100J | NXS0104PW-Q100 |
|
|
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXS0104_Q100 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2024-04-04 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
Ordering, pricing & availability
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