PCMFxUSB30
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
|---|---|---|---|---|---|---|---|---|---|
| PCMF1USB30 | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Unidirectional | 1 | 5 | 0.25 | 7 | 15 |
| PCMF2USB30 | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Unidirectional | 2 | 5 | 0.25 | 7 | 15 |
| PCMF3USB30 | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Unidirectional | 3 | 5 | 0.25 | 7 | 15 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PCMF1USB30 | PCMF1USB30Z (934069586087) |
Active | P "with circle" |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暫無(wú)信息 | |
| PCMF2USB30 | PCMF2USB30Z (934069593087) |
Active | P with circle |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | |
| PCMF3USB30 | PCMF3USB30Z (934069585087) |
Active | P with circle |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PCMF1USB30 | PCMF1USB30Z | PCMF1USB30 |
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| PCMF2USB30 | PCMF2USB30Z | PCMF2USB30 |
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| PCMF3USB30 | PCMF3USB30Z | PCMF3USB30 |
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文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PCMFXUSB30_SER | Common-mode EMI filter for differential channels with integrated ESD protection | Data sheet | 2017-05-04 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
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