外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| OL-IP3319CX6 | WLCSP6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | 2013-06-11 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| OL-IP3319CX6 | 3D model for products with OL-IP3319CX6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-IP3319CX6 | Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body | Package information | 2022-07-13 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
| 型號(hào) | 描述 | 快速訪問 |
|---|---|---|
| IP3319CX6 | Single-channel common-mode filter with integrated ESD protection network |
|