外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT137-1 | SO24 | plastic, small outline package; 24 leads; 1.27 mm pitch; 15.4 mm x 7.5 mm x 2.65 mm body | MS-013 (JEDEC) | 2003-02-19 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT137-1 | 3D model for products with SOT137-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT137-1 | plastic, small outline package; 24 leads; 1.27 mm pitch; 15.4 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-21 |
| SOT137-1_118 | SO24; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|