外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT355-1 | TSSOP24 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SOT355-1_118 | TSSOP24; Reel pack for SMD 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SOT355-1_128 | TSSOP24; Reel pack, SMD, 13" Q4/T2 standard product orientation Orderable part number ending ,128 Ordering code (12NC) ending 128 | Packing information | 2020-04-27 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| NCA9535PW-Q100 | Low-voltage 16-bit I2C and SMBus low-power I/O expander with interrupt output and configuration registers |
|