Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more information74ABTH162245ADL
此產(chǎn)品已停產(chǎn)
參數(shù)類型
| 型號 | Package name |
|---|---|
| 74ABTH162245ADL | SSOP48 |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABTH162245ADL | 74ABTH162245ADL,11 (935228910112) |
Obsolete | ABTH162245A Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| 74ABTH162245ADL:11 (935228910118) |
Obsolete | ABTH162245A Standard Procedure Standard Procedure | SOT370-1_118 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ABTH162245ADL | 74ABTH162245ADL,11 | 74ABTH162245ADL |
|
|
| 74ABTH162245ADL | 74ABTH162245ADL:11 | 74ABTH162245ADL |
|
|
Series
文檔 (5)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| abt | abt Spice model | SPICE model | 2013-05-07 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| abt | abt Spice model | SPICE model | 2013-05-07 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.